MAT 6400
MAT 6400 is a flexible die bonder and perform MCM, Hybrid, Flip Chip, Eutectic, Silver Glass die attach applications. It is a versatile and user friendly machine based on a PC platform running Windows XP®. It's features include
- Fully automatic system designed for highest flexibility and easy operation.
- Very High Accuracy closed loop servo systems control the X, Y motion of the bonding head.
- High resolution Digital Vision and Image Processing system.
- Adhesive is applied in single/multi dot and shape patterns by the Volumetric Dispenser. Library of complex pre-taught dispense shapes. Stamping (Pin Transfer) 100 ìm and under adhesive dots.
- Unique one-pass, wet Die Stacking capability with BLT control of all dice.
- Specializing in unusual Die Sizes and Aspect Ratios. Capability to attach CCD, Sensors and other sensitive components.
- Capability to handle MEMS devices. Experience with picking MEMS from wafer, design of special pickup tools, accurate BLT control for sealing.
- Full Flip Chip process including chip flipping, bump fluxing and chip final alignment over Up Looking Camera.
- Heated substrates with gas cover and heated pickup tools available for Eutectic processes. Ultrasonic bond head available for Eutectic and Gold to Gold Interconnection.
- The die presentation in many formats including: up to 30 Waffle/Gel packs, up to 8 Tape & Reel feeders, and 300 mm Wafers.