Wire bonder-Base G5/64000, Thin wire wedge-wedge bonder
The wedge-wedge bonder G5/64000 by F & K Delvotec covers the entire spectrum of thin wire applications optionally with 45° or 60 ° wire guide. It is the only wedge bonder worldwide which can be adapted to other processes in the minimum time of less than 20 minutes. Its dynamic bond head is based on the latest development and enables higher loop checks and a special wire guide.