Wire bonder-Base G5/62000, Gold-ball bonder
The hybrid gold-ball bonder from F & K Delvotec offers a large operational area and impresses with its versatility. Compared to the G4 product series its operational range has been enlarged once more, with outstandingly fast retooling times - it's the only gold-ball bonder which can be adapted to other bonding processes in less than 20 minutes. This means it can also handle thin wedge-wedge, thick wedge-wedge and deep-access. Some of the core technological optimisation features are the fact that bonding takes place in the direction of the transducers and that the singeing unit can be removed out of the way.