5410 - Gold Ball Semi-automatic Wirebonder
Flexible, hybrid bonder for gold ball applications 17.5 - 50 micron.
Suitable for laboratory, prototyping, repair or small scale production:
- Multi-wire function
- Touch-down sensing (bonding parameters are delivered on 'actual' contact with substrate)
- Bond Process Control (real-time bond deformation control software)
- Motor driven Y & Z axis (step-back)
- Tailing is voicecoil driven, allowing for more consistent & reliable bonding with fewer lost wires
- Stitch bonding
Bond heads are based on the parent automatic machine (6400 & G5), designed to be exchanged to suit customer application
i.e. Gold ball, Fine wire (30/45 or 60 degree), Deep access & Heavy wire.
The general design of the bonder allows for minimum maintenance with maximum flexibility.