5410 - Semi-automatic Gold Ball Wirebonder
Flexible, hybrid bonder for gold ball applications.
Suitable for laboratory, prototyping, repair or small scale production:
- Process 17.5 to 50 micron wire
- Multi-wire function
- Bond Process Control (real-time bond deformation control software)
- Motor driven Y & Z axis (step-back)
- Variety of loop formations, including reverse loop
- Touch-down sensor initiates bonding on actual contact with substrate
- Stitch bonding
- Tailing controlled, more consistant bond foot & fewer 'lost wires'
- Programs saved to floppy or internal hard drive
Bonding Heads available:
Gold Ball, Fine Wire, Deep Access, Heavy Wire
The design of the bonder allows for minimum maintenance with maximum flexibility.