5330 - Manual Wedge Bonder
Entry level bonder for wedge bonding applications.
Windows driven software, through a shuttle-wheel menu allows the user quick and intuitive control of the wirebonding process.
Loops are formed by hand & facilitated through a motorised Z motor.
Touch-down sensor ensures bonding parameters are delivered on 'actual' contact with substrate.
Tailing is voicecoil driven, allowing for more consistent & reliable bonding with fewer 'lost wires'.
The general design of the bonder allows for minimum maintenance with maximum flexibility.
Rework & small scale production are typical applications for the 53xx series bonder.