5330 - Manual Wedge Bonder
Entry level bonder for wedge bonding applications.
The 5330 Wedge Bonder is the machine of choice for research institutes, laboratories and production environments where optimum control and repeatability are required at a budget price.
Features:
- Intuitive, Windows driven bonder with shuttle-wheel operation
- Aluminium & Gold wire processing from 17.5 to 75 micron
- Ribbon processing upto 125 micron
- Automatic feed and tail function, allows optimal, user-friendly bonding
- Bump and stitch bonding modes
- All parameters saved to hard disk
- Colour display
- Variety of loop formations, including reverse loop
- Tailing voicecoil controlled, more consistant bond foot & fewer 'lost wires'
- Loop formation by hand with motorized Z control
- Touch down sensor initiates bonding on 'actual' contact with substrate
- Ergonomic head design means less maintenance
- Easy threading
- Minimum training required