53xx BDA - Ball & Deep Access Bonder
Entry level wirebonder for prototype, rework or small scale production
Intuitive, Windows driven bonder with shuttle-wheel operation
Tailing voicecoil controlled, allowing for more consistant bond foot & fewer 'lost wires'
Loop formation by hand with motorized Z control
Touch down sensor initiates bonding program on 'actual' contact with substrate
Ergonomic head design - less maintenance
Easy threading
Switch between ball and wedge bonding with a simple tool change