53xx BDA - Manual Ball & Deep Access Bonder
Entry level bonder for ball, wedge & ribbon bonding applications
The 5330 Wedge Bonder is the machine of choice for research institutes, laboratories and production environments where optimum control and repeatability are required at a budget price.
Now with step-back function!
Features:
- Intuitive, Windows driven bonder with shuttle-wheel operation
- Aluminium & Gold wire processing from 17.5 to 75 micron
- Ribbon processing upto 125 micron
- Automatic feed and tail function, allows optimal, user-friendly bonding
- Bump and stitch bonding modes
- All parameters saved to hard disk
- Colour display
- Variety of loop formations, including reverse loop
- Tailing voicecoil controlled, more consistant bond foot & fewer 'lost wires'
- Loop formation by hand with motorized Z control
- Touch down sensor initiates bonding on 'actual' contact with substrate
- Ergonomic head design means less maintenance
- Easy threading
- Minimum training required
- Switch between gold ball and deep access with a simple tool change