5310 - Manual Gold Ball Bonder
Entry level bonder for ball bonding applications.
The 5310 Gold Ball Bonder is the machine of choice for research institutes, laboratories and production environments where optimum control and repeatability are required at a budget price.
Features:
- Intuitive, Windows driven bonder with shuttle-wheel operation
- Wire processing from 17.5 to 50 micron
- Bump and stitch bonding modes
- All parameters saved to hard disk
- Colour display
- Variety of loop formations, including reverse loop
- Loop formation by hand with motorized Z control
- Touch down sensor initiates bonding on 'actual' contact with substrate
- Tailing voicecoil controlled, more consistant bond foot & fewer 'lost wires'
- Ergonomic head design means less maintenance
- Easy threading
- Minimum training required