Products from F&K Delvotec
Please find a list below of the products from F&K Delvotec. Should you not be able to find what you are looking for, please contact us at sales@sitest.co.uk or on +44(0)1202 861733
5310 Manual gold Ball Wirebonder
Entry level wirebonder for prototype, rework or small scale production
5330 - Manual Wedge Bonder
Entry level wirebonder for prototype, rework or small scale production
53xx BDA - Ball & Deep Access Bonder
Entry level wirebonder for prototype, rework or small scale production
5410 - Gold Ball Semi-automatic Wirebonder
Flexible, hybrid bonder for gold ball applications 17.5 - 50 micron Suitable for laboratory, prototyping, repair or small scale production5430 - Fine Wire Semi-automatic Wedge Bonder
Flexible, hybrid bonder for fine wire applications 17.5 - 75 micron. Suitable for laboratory, prototyping, repair or small scale production.5432 - Semi-automatic Deep Access Wirebonder
Flexible, hybrid bonder for fine wire applications 17.5 - 75 micron. Suitable for laboratory, prototyping, repair or small scale production.5450 - Semi-automatic Heavy Wire Bonder
Flexible, hybrid bonder for fine wire applications 100 - 500 micron. Suitable for laboratory, prototyping, repair or small scale production.
5610 - Automatic Gold Ball Bonder
Fully-automatic bonding with a desktop machine. Interchangeable Bond Heads available for every application - including Pull & Shear test!
5630 - Automatic Fine wire (wedge) Bonder
Fully-automatic bonding with a desktop machine. Interchangeable Bond Heads available for every application - including Pull & Shear test!
5632 - Automatic Deep Access Bonder
Fully-automatic bonding with a desktop machine. Interchangeable Bond Heads available for every application - including Pull & Shear test!
5650 - Automatic Heavy Wire Bonder
Fully-automatic bonding with a desktop machine. Interchangeable Bond Heads available for every application - including Pull & Shear test!62000 - Gold-ball bonder
The hybrid gold-ball bonder from F & K Delvotec offers a large operational area and impresses with its versatility64000 - Thin wire wedge-wedge bonder
Covers the entire spectrum of thin wire applications64000DA - Deep access bonder
A deep-access version of the G5 for especially demanding thin-wire applications66000 - Thick wire wedge-wedge bonder
The thick-wire bonder with the most productive bond head worldwide66000HR - Heavy ribbon bonder
Heavy ribbon bonder from the G5 seriesFMI 555BD
Beam Lead Diode Bonder
FMI 555E
Epoxy Bie Bonder Entry-level machine for R&D or small scale production
FMI 555EU
Eutectic Die Bonder
ODS 10
Highly accurate optical vibrometer for checking bonder ultrasonics
TTS-030
Electrical test of the Ultrasonic pathway